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Technical Capacities
Layer count:
Produces Type:
HF(High Frequency) & (Radio Frequency) board, Impedance controlled board, HDI board, BGA& Fine Pitch board, Thicker Copper (Up to 20 OZ) board
Base material: FR4 (Shengyi China, ITEQ)
HF&RF Products: Rogers, Taconic, Arlon, Nelco, Isola and so on
Solder Mask: Nanya & Taiyo
Finished Surface: Conventional HASL, Lead-free HASL,  Flash Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold
Selective Surface Treatment: ENIG(immersion Gold) + OSP,    ENIG(immersion Gold)+Gold Finger,  Flash Gold + Gold Finger,   Immersion Silver + Gold Finger,    
Technical Specification
Minimum line width/gap: 3.5/4mil(laser drill)
Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper   thickness: 20 OZ
Max production size: 600×1000mm
Board Thickness: D/S: 0.2-7.0mm, Multilayers: 0.40-7.0mm
Min Solder Mask Bridge: ≥0.08mm
Aspect ratio: 15:01
Plugging Vias capability: 0.2-0.8mm
Platde holes Tolerance: ±0.08mm(min±0.05)
Non-plated hole tolerance: ±0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.15min(min±0.10mm)
Functional test :
Insulating resistance :         ≥50 ohms (mormality)
Peel off strength:                 1.4N/mm
Thermal Stess test :            265,20 seconds
Solder mask hardness:       ≥6H
E-Test voltage :                   ≥500V+15/-0V 30S
Warp and Twist: ≤0.7% (semiconductor test board≤0.3% )

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