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Electronics Reliability and Sustainability Focus of IPC Technical Conference
                                                                Electronics Reliability and Sustainability Focus of IPC Technical Conference
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications
The session, “Product Sustainability: Managing Tin Whiskers and Product Lifecycle Analysis,” will help engineers and managers mitigate the development of the growing phenomenon of tin whiskers. Research paper presentations from Samuel Platt, Delphi Electronics &  Safety, and Aaron Pedigo, NSWC Crane, will identify fundamental mechanisms causing whisker growth and provide insight into processing steps that reduce the potential for damage by whiskers. Jørgen Vos and Santanu Roymoulik, PTC, will address quality and reliability management challenges across the product lifecycle, including advanced compliance management through leveraging of standards such as IPC-1752.

Answering the age-old question of whether voids in solder joints are good or bad things, Bev Christian, Ph.D., Research in Motion, and Dave Hillman, Rockwell Collins, team up in “Minimizing Defects in Assembly Processes.” The session will also include other industry experts who will discuss isolating sources of head-on-pillow defects and using IPC stencil design rules to address fine pitch components.

Components with low under-clearance have often been the subject of product reliability discussions due to their tendency to entrap process chemicals such as flux and cleaning fluids. In “Tackling Lead-Free Solder Alloys,”
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